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- 概述
- 人工智能沙巴体育结算平台
生成的人工智能
微米’s purpose-built memory and storage solutions enable endpoint generative AI experiences for all, 从实时自然语言处理到个人助理和人工智能艺术品. Learn how 微米 brings the speed and 能力 required to run generative AI applications on endpoint devices.
智能制造
美光把“人工智能”放在了质量上. 我们的团队成员在我们的智能工厂与人工智能并肩工作, 利用数据来改变操作,并达到历史水平的产出, 我们业界领先的内存和存储解决方案的产量和质量. 了解美光的解决方案如何支持人工智能驱动的工业4.0.0机械.
商业中的人工智能
微米’s high-表演 memory and storage solutions drive practical business intelligence. 了解我们最新的高性能机器学习解决方案, deep learning and the innovation-focused AI companies that 微米 has invested in for the future.
常见问题
当涉及到人工智能工作负载时, 内存在决定系统的整体性能方面起着至关重要的作用. Two prominent types of memory that are often considered for AI workloads are high-bandwidth memory (HBM) and double data rate (DDR) memory, 特别是DDR5. 哪种内存适合人工智能工作负载取决于各种因素, 包括人工智能算法的具体要求, 数据处理的规模和整体系统配置. HBM3E和DDR5都具有显著的优势, 它们的适用性取决于特定的用例, 预算和可用的硬件选项. 美光提供最新一代的HBM3E和DDR5.
HBM3E memory is the highest end solution in terms of bandwidth, speed and energy efficiency1 由于其先进的架构和高带宽能力. DDR5 memory modules are generally more mainstream and cost-effective at scale than HBM solutions.
对于人工智能工作负载,理想的存储解决方案取决于几个因素. 关键的考虑因素应该包括速度, 表演, 能力, 可靠性, 持久性和可伸缩性. The best storage solution for AI workloads depends on the specific demands of your applications, 您的预算和整体系统配置. 美光可以为您的特定需求提供一流的NVMe固态硬盘. 美光9400 NVMe固态硬盘 为PCIe设定了新的性能基准® Gen4存储. It packs in up to 30TB of 能力 and is designed for critical workloads like AI training, 高频交易和数据库加速. 美光6500 ION NVMe固态硬盘 网络数据湖的理想高容量解决方案是什么.
混合人工智能, 有时被称为分布式人工智能, 是基于云计算和基于边缘的人工智能系统的混合体.
目前, 大多数人工智能系统都位于数据中心,可以通过云服务访问, 为生成式人工智能等应用程序提供最强大的性能.
另一方面, edge-based人工智能, 也被称为设备上人工智能, refers to an AI system where data processing occurs directly on the device (such as smartphones, 汽车, 个人电脑和物联网设备). 这消除了将所有数据连续发送到云或从云发送的需要, 提高隐私, 带宽和延迟限制, 它也可以在没有连接的情况下工作.
The hybrid approach distributes and coordinates AI workloads among cloud and edge devices. Balancing cloud-based AI models with models that run directly on devices allows for real-time, 边缘的自主决策, 辅以长期的云分析和改进.
在本质上, hybrid AI aims to provide the best user experiences by taking advantage of the respective strengths of both cloud-based and edge-based人工智能.
1微米 HBM3E提供更高的内存带宽,超过1.2TB/s和50%以上的容量相同的堆栈高度. Data rate testing estimates are based on shmoo plot of pin speed performed in manufacturing test environment.
1微米 HBM3E提供更高的内存带宽,超过1.2TB/s和50%以上的容量相同的堆栈高度. Data rate testing estimates are based on shmoo plot of pin speed performed in manufacturing test environment.